Diamond grinding Pad

Diamond Grinding Pad is suitable for Crystalline, optical glass and other application Brittle glassy material.

Pad properties:

Dimension: Diameter 200–1510 mm

Diamond grit: 120μm, 80μm, 45μm, 30μm, 20μm, 12μm, 9μm, 4μm, 2μm

Abrasive layer thickness: 0.9 mm

Bond type: Resin bond, Square structure

Carrier material: Polycarbonate

Backing: Self-adhesive, Metal foil only for diameter 200–400 mm

Grinding Parameter:

Dressing: Green Silicon Carbide grinding stone, 280# for the coarse abrasive(120μm, 80μm), 400# for the fine abrasive

Grinding:

Press: recommend 1.5 psi on the glass surface

Coolant: Flow— 200 ml/min, when the plated surface temperature is higher, please increase the amount of flow

Pre grinding, the cutting force will be very high, so the shorter grinding time is better.