Dicing Blade for IC Package Dicing, Slicing
More Superhard dicing blade options for IC package dicing process. Here are some dicing blade specifics
| Blade OD = 4.6″
Blade ID = 3.497″ Blade Thickness = 0.004″ (0.100mm) Blade Type = Resin bond Material = 90% alumina, 0.8mm – 1.2mm thick Dicing tool = ADT Pro-Fortis 4″ spindle Advantages of Dicing Blade: The diamond dicing blade that wears relatively well and still yields good cut quality with respect to chipping/cracking of the workpiece material.
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Resin bond dicing blades are used for precision singulating, slicing, dicing, and slotting BGA, CSP, and other chip carrier packages, glass for optics and photonics, discrete electronic components, such as MLCC (Multi-layer ceramic capacitors), thin-film disk drive heads, ceramic, steels, ferrite, PZT
Moresuperhard has standard dicing blades available for many applications and all brands of sawing and dicing machines (such as Disco, ADT, Ukam, K&S, Towa, Besi, ASM Pacific).
Diamond dicing blades are fabricated with the highest quality diamond, CBN and bond powders available. Critical properties such as friability, size, shape, concentration, and bond strength, Blade life can be enhanced by as much as four times that of conventional blades. We can custom formulate blades for your specific application to maximize throughput and cut quality.
manufacture processes for silicon wafer Semiconductor
