Moresuperhard moveforward to CIOE 2021

Shenzhen, known as the “capital of scientific and technological innovation”, has thus shown infinite vitality. Formnext+PM South China held successfully in Shenzhen International Convention and Exhibition Center from September 9 to 11.Moresuperhard has sent two representatives to Shenzhen International Convention and Exhibition Center to participate in the exhibition and exchange learning.

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Analysis of the cause of cutter back-off in grinding PCD tool arc

The cause of cutter back-off in grinding PCD tool arc with diamond grinding wheel

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Vitrified CBN grinding wheel for grinding the artificial joint

Artificial joint head, including hip joint, knee joint, shoulder joint, etc., is a replacement for joint damage due to arthritis and other causes. It is a man-made model, mainly composed of titanium, cobalt and chromium alloy and other special metals, as well as ceramic, polymer polyethylene and other special materials.

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The hardness of grinding wheel should be opposite to workpiece

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Model Type of Double-Disc Grinding Machine and Grinding Workpieces

DDG(Double Disc Grinding) machine mainly uses the high speed rotation of grinding wheel to grind the surface of  the workpiece to achieve the accuracy. The working principle of different double disc grinding machine is also different.

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Application of diamond grinding wheel in high speed railway track plate processing

The rail plays the role of guiding the vehicle and transmitting the load to the subgrade.  After the high-speed and heavy-duty railway was put into operation, various surface injuries of rail appeared, such as corrugation wear of rail, abrasion of rail surface, strip of rail surface, severe wear of rail side, crack and crush of rail head, etc. And the development speed was fast, which affected the railway transportation capacity and economic benefit.

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Analysis of cause and solution of edge breakage in Wafer cutting

A wafer goes through three changes before it becomes a real semiconductor chip:

First, semiconductor chip is cut from a lump of ingots into wafers.

In the second step, a transistor is engraved on the front of the wafer by the previous step.

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Machining Principle of Double Disc Grinding

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Diamond tools for stone industry

Application: processing ceramic tile, granite, marble, limestone, quartz stone, sandstone, basalt, bluestone, shale and other natural stone, or concrete, refractory materials, ceramics, asphalt, cement pipe, microcrystalline stone, vitrified brick and other artificial imitation stone materials.

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