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Hybrid fluting test
2021-08-20Test tool specifications: integral HM twist drill D10.1*61*103*SD10.
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How to choose the suitable grinding wheel when for fluting carbide tools on CNC tool grinder?
2021-08-20CNC tool grinder is widely used, how to choose the right grinding wheel to get a good grinding effect? The commonly used resin bond grinding wheel and metal bond grinding wheel and hybrid bond grinding wheel are used for cutting tool grooving.
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Matters and problems of small aperture internal processing
2021-08-20Because it is often restricted by the diameter of the inner hole of the workpiece, the diameter of the inner circle processing is usually low, the speed is often affected by the speed of the inner spindle of the equipment, and the circumferential speed of the ceramic diamond grinding wheel is often lower than 30-35 m/s. Therefore, vitrified diamond grinding wheels are usually more efficient in machining roughness and cylindrical grinding.
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Moresuperhard will participate in CIOE 2021
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Comparison between CBN and SiC Grinding Wheel for Titanium Alloy
2021-08-04When use silicon carbide grinding wheel or other mixed-abrasive grinding wheels based on green silicon carbide for titanium alloy, the grinding wheel adheres to titanium alloy seriously, which leads to large grinding force and poor processing quality.
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Thermal spraying (tungsten carbide)
2021-08-03Thermal spraying does not mean that how thick can be sprayed, the thicker the thickness, the more difficult the spraying, because it is to be sprayed on the spraying surface again, the sprayed particles are not easy to adhere to it, resulting in loss of waste, so the cost will increase exponentially.The spray thickness is generally 40 wires.
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How to choose internal grinding Wheel?
2021-08-03Diameter of the grinding wheel is too large, the contact arc between the grinding wheel and the workpiece will increase, which will increase the grinding heat and make cooling and row cutting difficult. If the diameter of the grinding wheel is too small, it is difficult to achieve the ideal grinding speed (30m/s~50m/s), which increases the grinding thickness, increases the conformity of the grinding grains, and is easy to blunt, which increases the surface roughness of the inner hole and reduces the production efficiency when grinding the hole of workpiece.
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Dicing Blade selection for wafer cutting
2021-04-13At present, most of the wafer cutting is using high precision scribing machine, which is mainly mechanical processing.
Under the action of mechanical stress, the wafer is prone to quality abnormalities after cutting. Common quality abnormalities include: product surface, back Chipping, PAD oxidation, delamination, missing Angle and other abnormalities.
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The application of internal grinding wheel
2021-04-12Electroplated diamond grinding head is widely used in optical lens, prism, watch glass and sapphire glass. Through the processing of various workpiece, in order to achieve the effect of grinding, fitting, polishing.
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Grain Size Standard Comparison Chart
2021-04-02MoreSuperHard Standard Grain Size Standard International Comparison Chart
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