Grinding of the outer circle and inner hole: The circumferential surface of the grinding wheel is mainly used as the grinding working surface, which is tangent to the machined surface of the part, and the sprayed surface of the outer circle and inner hole is ground.

When the hardness of plasma spraying is relatively high and the processing volume is relatively small, the coating treatment is more suitable for grinding. Because plasma spraying has a special structure, it makes the coating material more difficult to grind. The selection of coating grinding methods and process specifications mainly depends on the structure and hardness of the coating. Reasonable selection of grinding methods and process specifications can not only improve the surface finish and grinding efficiency of the coating, but also reduce the stress at the interface between the coating and the substrate. According to the form of the grinding wheel working surface, there are basically two methods for plasma spraying.
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The edge grinding process can effectively improve the brittleness of the glass, making the glass more beautiful and safer. Generally speaking, it is enough to use a coarse grinding wheel to grind off the corners of the glass. However, the requirements for craft decorations are higher and require rough grinding and fine grinding to make the original glass of different shapes and sizes gradually close to the workpiece required by the customer. size and surface roughness.

CMP Pad Conditioner uses advanced diamond planting technology to fix diamond abrasive grains on the substrate in an orderly manner according to the designed pattern. It uses precision electroplating to match diamonds of different sizes, shapes, and pattern designs to provide different A series of polishing pad removal rate products can be widely used in various scenarios that require planarization.

Power semiconductor packaging paste (power semiconductor chip packaging sintered silver, ceramic copper clad plate brazing paste, etc.)

This study is also a field of deep digging and extension, need to slowly digest, packaging is an important step during the semiconductor process, also involves the packaging grinding products used, Moresuperhard have many customers in the the current packaging grinding, and cutting but also need to expand.

The edge grinding process can effectively improve the brittleness of the glass, making the glass more beautiful and safer. Generally speaking, it is enough to use a coarse grinding wheel to grind off the corners of the glass. However, the requirements for craft decorations are higher and require rough grinding and fine grinding to make the original glass of different shapes and sizes gradually close to the workpiece required by the customer. Size and surface roughness.

Different grinding methods

Honing is the workpiece does not move, honing head for rotation and up and down reciprocating movement. Internal grinding requires that the grinding pin rotates and reciprocates after the workpiece is clamped.

Grinding different holes

Honing is mainly suitable for some longer and deeper through holes and blind holes. Internal grinding generally works short holes.

Honing process (Honing Process) is a special form of grinding and an efficient processing method in finishing. It is a finishing process and needs to be carried out on the basis of grinding or fine boring. This process can not only remove It has a large machining allowance and is an effective processing method to improve the dimensional accuracy, geometric shape accuracy and surface roughness of parts. The scope of honing processing is relatively wide, especially in mass production, it is more economical and reasonable to use a special honing machine for honing. For some parts, honing has become a typical finishing processing method, such as engine cylinder liners, connecting rod holes and hydraulic cylinders. Tube etc.

The 6th China International Abrasives and Grinding Exhibition has come to a successful conclusion. As a company focused on providing customers with cutting, grinding and polishing solutions, Moresuperhard also participated in this exhibition. Moresuperhard booth number is B33.  We also live broadcast the booth and the grand event for everyone.

China International Optoelectronic Exposition (CIOE) is the world’s largest and most influential comprehensive exhibition of the optoelectronic industry, covering information communication, laser, infrared, ultraviolet, precision optics, chip materials, camera technology and application, intelligent sensing, new display, etc. The section displays cutting-edge optoelectronic innovation technologies and comprehensive solutions for optoelectronics and applications. In 2023, Moao Optoelectronics Group will go to Shenzhen again to participate in the exhibition, providing “cutting, grinding and polishing” for your processing of high-precision single crystal tools and photovoltaic semiconductor materials. solution.

Electroplated diamond abrasive belt grinding is a compound processing technology that uses flexible grinding tools to perform multiple functions of grinding, grinding and polishing. It has a “cold” effect and is especially suitable for hard and brittle non-metallic materials and non-ferrous metals. processing.