Glass cutting needs to use glass edging machine for edging processing glass edging machine is mainly through grinding head motor and grinding wheel to achieve glass grinding and polishing, ordinary unilateral/bilateral edging machine can achieve rough grinding and fine grinding and polishing once completed customers can choose different grinding wheels according to their own processing requirements.

Double disc end face grinding technology is a must to find an efficient grinding solution to meet various requirements of the workpieces. A wide range of grinding tasks and a large variety of work, which require more precision and flexibility of grinding itself. The face grinding especially double face grinding is necessary.

In the grinding process, dressing plays a vital role in continuous and consistent processing, and dressing is divided into shaping and sharpening. Shape modification: The shape of the grinding wheel changes during the grinding process, and it is necessary to restore the grinding wheel to the desired state (including shape and accuracy, etc.) by dressing. Sharpening: abrasive will become blunt in the process of work, need to be blunt repair, new abrasive, sharp and leakage.

In order to make PCBN cutting tools give full play to its performance, cutting tool edge treatment is a problem that must be considered. Whether PCBN cutting tool treatment is reasonable directly affects the tool life.

Bearing is an indispensable core component in mechanical and electronic equipment. Its main management function is to support the Chinese mechanical rotating body, reduce the influence coefficient of trade friction and ensure the rotation accuracy. Regardless of aircraft, cars, high-speed rail or high precision machine tools, all rotating parts generally need bearings.

In terms of pcd tool angle, a smaller rake angle is generally selected for cutting titanium alloys to increase the contact length between the chip and the rake face; at the same time, a larger clearance angle is selected to reduce the friction between the flank face and the machined surface.

Wafer back grinding is a step in semiconductor device manufacturing in which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits.

Honing is a method of finishing workpiece surface at low cutting speed. It is a special form of grinding and an efficient machining method in finishing machining.