Bond refers to the material bonded various bonding bond and abrasives. Bonded abrasives usually use vitrified, resin, metal and other bond. Binders can be divided into inorganic binders and organic binders.

Drilling is the first process of machining holes in solid materials. The diameter of drilling hole is generally less than 80mm. The common drilling tool has Twist drill, Center drill, Deep hole dWhat’s the difference between drilling, boring, reaming and honing? It’s hard for most people to tell the difference. Now I will be explain creating and modifying hole on a work-piece differences to yourill, etc.

The cylinderical grinding of the bearing ring needs to be processed by centerless grinding machine. Generally speaking, the segmented centerless grinding can achieve very high accuracy. It is mainly divided into coarse grinding, semi-fine grinding, fine grinding. Each stage removes enough margin to ensure that the next grinding stage does not cause problems such as burns or ripple marks. After fine grinding, the product can reach the dimensional precision of finished product. Centerless grinding are also used for machining small size rolling bodies such as rollers and needles.

Grinding is a mechanical processing method that removes material. In a narrow sense, it refers to the processing method of removing excess material on the workpiece with an abrasive tool. Grinding wheels, superabrasive tools, grinding heads, mounted points, sand tiles, oilstones, abrasive belts, etc.

The diamond grinding wheel of #800(particle size 20 μm) can quickly remove the surface material of gallium oxide wafer without cleavage breaking, but the surface damage is serious and there are a lot of obvious microcracks. The surface quality of gallium oxide wafer grinding with diamond wheel 1000(grain size 16 μm) was significantly improved, and only a few microcracks were observed on the wafer surface. The ultra-smooth surface processing technology of gallium oxide wafer was determined by using #800 diamond grinding wheel, #1000 diamond grinding wheel and silica sol polishing solution successively.

One of the purposes of cutting tool sharpening is to obtain cost-effective cutting edge quality, and the key to quality is the choice of the size of the sharpening wheel. The finer the particle size of the grinding wheel, the smaller the chipping of the cutting edge, and the lower the grinding efficiency.

Cylindrical grinding generally has longitudinal grinding, horizontal grinding and deep grinding three ways.

The hardness of CBN grinding wheel is too high: the grinding wheel with proper hardness should be replaced.

Whether it’s Apple, Samsung, or Huawei, smartphone screens are getting bigger and bigger, and the majority of smartphone screens are made of optical glass (made by grinding and polishing).