HR-14H Black polyurethane polishing pad
Ultra finishing black polyurethane polishing pads
Optical lenses,LCD, silicon and compound semiconductor wafers polishing
Width: 50-1350mm
Thickness: 0.5, 0.8, 1.0, 1.2, 1.4mm.
Product Details
Black polyurethane polishing pads are made of proprietary polyurethane and incorporate a unique, vertically oriented pore structure with a compressible substrate. The black polyurethane polishing pads is a polishing pad for final polishing of semiconductor wafers and hard disks, etc.
Application of Black polyurethane polishing pads:
Ultra finishing black polyurethane polishing pads are used in the fixture of optical instruments and optical lenses, the polishing protection of lenses, and the final polishing of optical components, optical glass, crystals and metal materials.
* First and final polishing of silicon and compound semiconductor wafers
* Metal disks such as aluminum and nickel
* Polishing glass substrates for LCDs, photomasks and hard disks
* Optical lenses and various optical glass parts
* Semiconductor devices
* Plastic lenses, stainless and copper plates, etc
Features of Black polyurethane polishing pads:
(1) Good elasticity, soft force and no scratches during polishing
(2) Fine texture, uniform thickness, and long service life.
Several kinds of patterning and grooving, such as emboss processing, groove processing and slurry hole processing can be performed on the pad upon request of your requirement, ultra finishing black polyurethane polishing pads with double-sided adhesive on the back of polishing pads.
Drawing&Specification
| PHYSICAL
PROPERTIES |
Unit | SPECIFICATION | TEST DATA |
| WEIGHT | g/m² | 620± 100 | 668 |
| THICKNESS | mm | 1.44±0.1 | 1.42 |
|
RECOVERY |
％ | 81± 15 |
76 |
| COMPRESSIBILITY | ％ | 4.8 ± 1.0 | 3.8 |
| HARDNESS |
SHORE A |
60± 3 |
62 |
| THICKNESS OF NAP LAYER | μm | 550± 100 |
530 |
| OPENNING PORE SIZE |
μm |
70±20 |
71 |
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