Grinding Mode

Back Grinding Wheels for Silicon Wafer ThinningBack Grinding Wheels for Silicon Wafer ThinningBack Grinding Wheels for Silicon Wafer Thinning
Back Grinding Wheels for Silicon Wafer ThinningBack Grinding Wheels for Silicon Wafer ThinningBack Grinding Wheels for Silicon Wafer Thinning

Back Grinding Wheels for Silicon Wafer Thinning

Surface quality: require grinding lines evenly, without chipping, debris, scribe, etc.;

Processing accuracy: TTV <5 um etc. (Total thinning veracity)

Processing quality:surface roughness: < 10 nm; damage layer thickness: < 10 um

Product Details

Description:

Silicon grinding wheels are mainly used for trimming of silicon wafer. These products produced by our institute,which possess superior grinding performance and high cost performance,are among the top level worldwide. 

Back grinding wheel

 

Application: back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Applicable Grinding Machine:

The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine

Advantages:

1.surface quality: require grinding lines evenly, without chipping, debris, scribe, etc.;

2.processing accuracy: TTV <5 um etc. (Total thinning veracity)

3.Processing quality:surface roughness: < 10 nm; damage layer thickness: < 10 um

Drawing&Specification

Model

D (mm)

T (mm)

H (mm)

6A2/6A2H

6A2/6A2H

175

30, 35

76

200

35

76

350

45

127

6A2T

6A2T

195

22.5, 25

170

280

30

228.6

6A2T(three ellipses)

6A2T(three ellipses)

350

35

235

209

22.5

158

Other specifications can be produced according to customers’ requirement.

 

Inquiry

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