Diamond Cutting Blade Saw for Metallographic Cutting Machine
Metal bond diamond cutting blades
– precision cutting hard materials, ceramic and petrographic samples, semiconductor, composites, glass, quartz, crystal, metallography, photonics, semiconductor, etc
Type: 1a1r diamond cutting blades
Product Details
The premise of metallographic analysis is to prepare better metallographic sample products. At present, metallographic samples are mainly prepared by diamond and cbn cutting discs. Therefore, it is particularly important to choose high-quality metallographic cutting wheels. Diamond blade is a saw blade which has diamonds fixed on its edge for cutting hard or abrasive materials. Cutting precision 0.01mm.
Applications of Diamond Cutting Blade Saw
Precision cutting hard materials, ceramic and petrographic samples, plastics and polymers, steel, non-metallic material, circuit board, semiconductor, composites,glass,quartz, crystal, metallography, photonics, semiconductor, etc
Cutting machine: cutting OM (optical microscope), SEM (scanning electron microscope), and even TEM (transmission electron microscope) specimen.
The main features of metallographic diamond cutting saw blades
1. Cutting disc thickness: Metallographic cutting discs are thinner than general wet grinding wheel discs. For example, the thickness of 300mm diameter alumina general disc is 3.2-3.8mm thick, and the thickness of gold photo is 1.5-2mm. The thinner is for better control of cutting. The plastic deformation of the material structure caused by the cutting stress during the cutting process can also better control the accuracy of the cutting position
2. The slit is narrow, which can greatly increase the utilization rate of valuable raw materials
3. High efficiency, sharp cutting, no need for frequent tool changes
4. High rigidity, high strength, long service life
Metal diamond cutting blade for PCB board
Metal diamond cutting blades are installed into the precision metallurgical sample cutting machine/PCB cut machine for cutting PCB /SMT semiconductors.
Metal diamond cutting blades is can be used for cutting kinds of composite circuit boards, such as copper-based,rubber-based, and plastic-based circuit boards.
Advantages of metal diamond cut off wheel for slicing PCB board
* Goods sharp
* Non-sticky
* High precision
* Good surface quality
* Extremely high service life
| Model | 1A1, 1A1R |
| Specification | Φ100(4in)×0.3×12.7(1/2in),Φ100×0.7×Φ12.7mm |
| Φ125×0.4×12.7,Φ125×0.5×12.7mm, | |
| Φ175×0.7×12.7mm | |
| Φ180×0.63×12.7(1/2in) | |
| Φ203(8in)×0.80×22（1in） |
Drawing&Specification
The sizes of diamond cutting blades
| Product Specification(mm) | Product Number | Applicable Materials |
| 100X12.7X0.3 | DIA-100 | Glass,Quartz,Polycrystalline Silicon,Ceramic,Hard Alloy |
| 127X12.7X0.4 | DIA-125 | Glass,Quartz,Polycrystalline Silicon,Ceramic,Hard Alloy |
| 150X12.7X0.4 | DIA-150 | Glass,Quartz,Polycrystalline Silicon,Ceramic,Hard Alloy |
| 175X12.7X0.8 | DIA-175 | Glass,Quartz,Polycrystalline Silicon,Ceramic,Hard Alloy |
| 200X25.4X0.8 | DIA-200 | Glass,Quartz,Polycrystalline Silicon,Ceramic,Hard Alloy |
| 230X12.7X1 | DIA-230 | Glass,Quartz,Polycrystalline Silicon,Ceramic,Hard Alloy |
| 250X32X1 | DIA-250 | Glass,Quartz,Polycrystalline Silicon,Ceramic,Hard Alloy |
| 300X32X1.8 | DIA-300 | Glass,Quartz,Polycrystalline Silicon,Ceramic,Hard Alloy |
| 350X32X2 | DIA-350 | Glass,Quartz,Polycrystalline Silicon,Ceramic,Hard Alloy |
| 400X32X2.5 | DIA-400 | Glass,Quartz,Polycrystalline Silicon,Ceramic,Hard Alloy |
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