Grinding/Polishing/ Lapping

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Grinding/Polishing/ Lapping

Grinding: The finishing process of the machined surface through the relative movement of the grinding tool and the workpiece under certain pressure by using the abrasive particles coated or pressed on the grinding tool.
Application of Grinding: It can process all kinds of steel, hardened steel, cast iron, copper and aluminum and its alloys, cemented carbide, ceramics, glass and some plastic products. Grinding is widely used to process various high-precision profiles in single-piece and small-batch production, and can be used in large-scale mass production.

grinding

Polishing: A processing method that uses mechanical, chemical or electrochemical action to reduce the surface roughness of the workpiece to obtain a bright and flat surface.
Application of Polishing: Polishing can process simple surfaces such as flat surfaces, but cannot be processed for curved surfaces. If processing complex surfaces such as R arcs and curved surfaces, the Hauke ​​energy polishing process can be used.

grinding

There is no essential difference between grinding and polishing, except for the choice of abrasive and abrasive materials. Polishing generally cannot improve the shape accuracy and dimensional accuracy of the workpiece, and polishing usually uses fine abrasive particles below 1µm.
Moresuperhard focuses on R&D and production of ultra-precision electrostatic sand-planting polishing film & polishing tape, polyurethane & damping cloth polishing pad, grinding fluid & abrasive paste, CMP polishing fluid and other ultra-precision polishing consumables.
Suitable for aluminum nitride, silicon nitride ceramic heat dissipation substrates, structural ceramics such as sealing rings, 3C electronic ceramics, ceramic corrugated rollers, ceramic anilox rollers and other superhard ceramics, lasers, optical fibers, displays and other optical ceramics, and solar cells, Sensors and other semiconductor ceramics, including a number of ceramic material subdivisions, have high polishing efficiency, stable polishing performance, ultra-precision polishing quality (Ra<0.2nm), high finished product qualification rate, and good polishing effect.

grinding and polishing

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