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Diamond Cutoff Wheel, Cutting Tungsten Carbide
Diamond Cutoff Wheel, Cutting Tungsten Carbide
Diamond Cutoff Wheel, Cutting Tungsten Carbide

Resin bonded Diamond Cutoff Wheel, Cutting Tungsten Carbide

Size : Diameter 20mm – 400mm

Type: 1A1R and 1A1 resin diamond cutting disc

Application: cutting tungsten carbide, mono crystalline and polycrystalline silicon, sapphire,quartz, specialty glasses, and a variety of other hard compounds and ceramic


Product Details

Resin bond diamond cutting wheels (diamond cut off wheels) with the characteristic of vertical consumption can efficiently reduce the occurrence of grain deformation and improve the cutting quality and efficiency on hard and brittle materials.

Features Of Resin Bonded Diamond Cutoff Wheel
– Improve the cutting quality and efficiency
– Chip free cutting, Cuts faster
– Good surface finish
Applications Of Resin Bonded Diamond Cutoff Wheel
Hard and Brittle Materials. Such as Ceramics, Optical Glass, Quartz Tubing Rods, Splitter, IR Filter, QFN, Carbide, Ultra Hard Steels and Metals .Resin Bond is the softest of all the bonds, used in applications that require a smooth surface finish.

Drawing&Specification

1a1r cutting wheel

Cutting wheels of 1A1R type diamond cbn cutoff wheels
The thickness of work layer is higher than the steel plate. They have advantages for removing chips and cooling.
They are mainly used for deep cutting and grooving of component.

Shape Diameter(mm) Thickness(mm) H(mm)
1A1 20.0≤D≤152.4 0.08≤D≤2.0 4.0≤D≤114.3
1A1R 30.0≤D≤400.0 0.2≤D≤2.0 4.0≤D≤127.0

We can also supply the following types: 1A1 1L1 14A1 1FF1 1F1 1EE1V 1V9 1A6Q 1A1R 1E6Q 14E6Q 14EE1 14E1 1DD1 4B1 1A8 etc

Inquiry

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