Wafer Dicing blades

Ultra - thin diamond dicing blade ( hub type and hubless type)
Binder includes: resin bond (soft), metal bond (medium) and electroformed nickel bond (hard)
Blade thickness: 0.015 mm - 0.3 mm
Silicon wafers of thickness 0.5 mm, 1 mm, 2 mm, 3 mm and 5 mm
Inducing as low as possible frontside and backside chipping of silicon wafer
Applications: Scribing silicon wafers, compound semiconductor wafers (GaAs, Gap), oxide wafers (LiTaO3),glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter,BGA, CSP,magnetic materials, PCB, silicon, etc