Wafer Dicing blades
Ultra - thin diamond dicing blade ( hub type and hubless type)Binder includes: resin bond diamond dicing blade (soft bond), metal bond diamond dicing blade (medium bond) and electroformed nickel dicing blade (hard bond)
Blade thickness: 0.015 mm - 0.3 mm
Applications: Scribing silicon wafers, compound semiconductor wafers (GaAs, Gap), oxide wafers (LiTaO3),glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter,BGA, CSP,magnetic materials, PCB, silicon, etc
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Diamond dicing blade is used for grooving ,cutting silicon, ...Diamond Dicing Blades For Semiconductor Industry
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Resin bond dicing blade can Cut sapphire, quartz glass, sili...Resin Diamond Dicing Blade for Silicon Wafer
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Ultra- Thin metal diamond dicing blade Thickness of dicing b...Metal bond Diamond Dicing Blades
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Hub type electroforming nickel bonded dicing bladeApplicatio...Electroformed Diamond Dicing Blade - Hub Type
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