High Ceramic Grinding Polishing
Cutting Tool Industry
Diamond Jewelry Industry
Automotive Industry
Bearing Industry
Woodworking Industry
Thermal Spray Coating Industry
Glass Industry
Oil&GAS Industry
LED & Semiconductor Industry
Medical Industry
Dressing Tools
Diamond & CBN Grinding Wheels
Honing Tools
End Surface Grinding
Vacuum brazed diamond tools

Wafer Dicing blades
Ultra - thin diamond dicing blade ( hub type and hubless type)Binder includes: resin bond (soft), metal bond (medium) and electroformed nickel bond (hard)
Blade thickness: 0.015 mm - 0.3 mm
Silicon wafers of thickness 0.5 mm, 1 mm, 2 mm, 3 mm and 5 mm
Inducing as low as possible frontside and backside chipping of silicon wafer
Applications: Scribing silicon wafers, compound semiconductor wafers (GaAs, Gap), oxide wafers (LiTaO3),glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter,BGA, CSP,magnetic materials, PCB, silicon, etc
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Diamond dicing blade is used for grooving ,cutting silicon w...
Diamond Dicing Blades For Wafer Scribing
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Resin bond dicing blade can Cut sapphire, quartz glass, sili...
Resin Diamond Dicing Blade for Silicon Wafer
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Hub type electroforming nickel bonded dicing bladeApplicatio...
Electroformed Diamond Dicing Blade - Hub Type
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Ultra- Thin metal diamond dicing blade Thickness of dicing b...
Metal bond Diamond Dicing Blades
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