LED & Semiconductor Industry
Manufacturing processes for silicon semiconductorSilicon Ingot - Cropping(electroplated bandsaw) - Cylindrical / Flat Grinding Silicon Rod - Ingot Silicon (diamond wire) - Lapping (double side wheel/polishing pad) - Edge Grinding - Surface grinding - polishing- wafer- patterning - back grinding (vitrified / resin wheels) - dicing (dicing blades)- chips - molding - packaging
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Silicon grinding wheels are mainly used for trimming of sili...Back Grinding Wheel for Surface Grinding Various Silicon Waf...
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Diamond dicing blade is used for grooving ,cutting silicon w...Diamond Dicing Blades For Wafer Scribing
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Resin bond dicing blade can Cut sapphire, quartz glass, sili...Resin Diamond Dicing Blade for Silicon Wafer
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Polishing and finishing of glass, LCD/LED substrates, precis...Polyurethane (PU) Polishing Pad for Wafer Surface
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The unrounded silicon wafer is mounted onto a grinding chuck...Edge Grinding Wheel, Silicon Wafer Chamfering
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Peripheral grinding of silicon ingots, or processing the out...Diamond Wheels for Silicon Ingot, Cylindrical Grinding/ OD G...
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Application: LED industry for back grinding of sapphire waf...Back Grinding Wheel for LED Substrate
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Hub type electroforming nickel bonded dicing bladeApplicatio...Electroformed Diamond Dicing Blade - Hub Type
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Ultra- Thin metal diamond dicing blade Thickness of dicing b...Metal bond Diamond Dicing Blades
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Electroplated diamond coated bandsaws are made from high qua...Electroplated Diamond Band Saw Blades
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