Back Grinding Wheel for LED Substrate

Application: LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers

Grinding Machines: NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc

Bonded: Vitrified bond & Resin bond

Diameter of Back Grinding Wheel: 200mm, 250mm, 280mm, 300mm, 350mm

Diameter of Epitaxial Wafer: 2", 4", 6"

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Product Details

Applications of LED epitaxial wafer back grinding wheel

LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers. It works well with European, American, Japanese and Chinese grinding machines with an excellent performance and cost effectiveness.

Applicable Grinding Machine

The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders ( Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc ).

back grinding wheel

Advantages of back grinding wheel for various wafer

* With low damage and high quality

* Nodeless consecutive processing is possible by the superior sharpness

* It helps minimize processing damage, improve processing efficiency and reduce processing cost, and is customizable according to customer needs

* Cool polished section

* Good surface finishes

Drawing&Specification

Model	D (mm)	T (mm)	H (mm)
6A2/6A2H	175	30, 35	76
	200	35	76
	350	45	127
6A2T	195	22.5, 25	170
6A2T	280	30	228.6
6A2T(three ellipses)	350	35	235
6A2T(three ellipses)	209	22.5	158
Other specifications can be produced according to customers’ requirement.

The case of vitrified diamond wheel for grinding wafer silicon in the microchip industry

back grinding wheel for silicon wafer

Application	Grinding wafer silicon in the microchip industry
Bonded	Vitrified bond Diamond Wheel
Wheel Type	12A2T /C
Size	18040104510, grit size 400# 18040104510, grit size 1500# 18040104510, grit size 4000#