Silicon Wafer Grinding
Application of back grinding wheels: back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Grinding Machines: Okamoto , Disco, TSK and STRASBAUGH, etc
Bonded: Vitrified bond, Resin bond
Diameter (mm): D175, D195, D209, D305, D335, etc
Manufacturing Processes for Silicon Wafers: Ingot, cropping, Peripheral grinding, Ingot slicing, double disc grinding or lapping, edge grinding, surface grinding, polishing, back grinding, dicing, chips
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Back Grinding Wheel for LED SubstrateBack Grinding Wheel for LED Substrate
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Edge Grinding Wheel, Silicon Wafer ChamferingEdge Grinding Wheel, Silicon Wafer Chamfering
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Diamond Wheels for Silicon Ingot, Cylindrical Grinding/ OD GrindingDiamond Wheels for Silicon Ingot, Cylindrical Grinding/ OD Grinding
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Polyurethane (PU) Polishing Pad for Wafer SurfacePolyurethane (PU) Polishing Pad for Wafer Surface
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Si/SiO2 WaferSi/SiO2 Wafer
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Diamond grinding tools for sapphire processing, silicon waferDiamond grinding tools for sapphire processing
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Back Grinding Wheel for Surface Grinding Various Silicon WaferBack Grinding Wheel for Surface Grinding Various Silicon Wafer
