Diamond Dicing Blades For Wafer Scribing

Diamond dicing blade is used for grooving , cutting silicon wafer, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed . Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade. The binders include resin bond dicing blade, metal bond dicing blade and electroformed nickel dicing blade.

How to selection of the correct types of wafer dicing blades to cut materials
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material

Dresser Board for dressing dicing blades
Dresser board is used for dressing and edged blade row,  to increase sharpness, and reduce the chipping of the work piece, to reshape and perfect the blade edge to a flat edge

Applications of wafer diamond dicing blade
Scribing / cutting silicon wafers, compound semiconductor wafers (GaAs, Gap), oxide wafers (LiTaO3), glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter, electronic parts, optical devices, semiconductor packages, BGA, CSP, various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon

Types	Features	Product Name
Electroformed dicing blade	• Good chip removal and cooling performance • Can carry on the difficult angle cutting and the step cutting processing• By adjusting the blades strength, can reduce the snake like cutting and blade damage • The workpiece has no flying edge, burr residue and high yield	Hub dicing blade
	Application:  Scribing dicing IC wafers, gallium arsenide, gallium phosphide, epoxy resin board, alloy frame, ceramic substrate, composite board with interlayer, etc
Resin bond dicing blade	• High processing quality for cutting of hard, brittle materials   • Improved cut quality on hard materials • Excellent cutting ability that help reduce chippingm fractures	Hubless dicing blade
	Application: cutting scribing glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), BGA, QFN （copper epoxy molding ), splitter, sapphire, ceramic substrate, alumina, aliminum nitride, etc
Metal bond dicing balde	• High rigidity minimized wavy & slant cutting • Excellent rigidity and cut quality
	Application:  Scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, PCB, ceramic, glass, quartz, crystal, ferrite, optical communication (Faraday), etc
Electroformed dicing balde	• Wide selection of blade options • Proprietary thin-blade technology • Blade thickness – 0.03 mm to 0.3 mm • Available for both dicing saws and slicers
	Application:  Scribing dicing silicon wafers, copper wafer and compound semiconductor wafers ( such as GaAs and SiC) , resistance, ceramic, packaging materials, lithium niobate, lithium tantalate, etc
Other specification can be produced according to customers’ requirements

The Case of Metal Diamond Dicing Blades for PCB

Case of metal diamond dicing blade:

Our customer using  other brand diamond dicing blade have chipping before, but try Moresuperhard metal diamond dicing blade do not occur chipping.