Dressing board for dressing diamond dicing blade

Why need dressing diamond dicing blade?

Diamond cutting blades are made from different binders: electroformed nickel, metal and resin.

Each diamond particle acts like a single cutting tool during the cutting process and requires sufficient exposure to freely penetrate into the base material.

Fully exposed diamond is always required to minimize loads during cutting and maintain a free and cryogenic cutting process. Poorly exposed diamonds will result in high loads and poor cut quality.

Dressing is the process of sharpening diamond particles so that they can penetrate freely into the material, minimizing load and providing good cut quality. Another reason to dress your dicing blade is to remove debris from the loading blade that fills the pores between the abrasive grains. Cutting into trim plates creates mechanical and thermal stresses, resulting in a clean surface.

A poorly trimmed dicing blade will tend to push the material causing high loads, high cutting temperatures/heat and poor cut quality, which can also lead to blade breakage.

Dressing—resin diamond dicing blade

In most cases, resin-bonded diamond dicing blade require no special dressing because wear out quickly and are self-sharpening.

Dressing- Nickel and metal diamond dicing blade

Nickel bond and metal bond blades have a harder bond and require more aggressive dressing.

Nickel bond cutting blades need dressing. Hubbed nickel bond cutting blades are manufactured partially pre-trimmed. Usually no dressing is required. dressing will remove any accumulated nickel or diamond protruding from the blade surface that has been sheared off.

Due to the nickel bond dicing blades are commonly used on silicon. The dressing depth must be deeper than the required production cutting depth, which will ensure that only the trimmed portion of the blade is used for production cuts.

Most nickel bond hub dicing blades do not require dressing when cutting silicon. However, for gallium wafers, dressing would be beneficial to extend blade life and improve cut quality. dressing blades for gallium and III-V wafers is particularly recommended.

Sometimes a blade that needs dressing is mistaken for a defective blade (a blade that cannot be used), but this is not necessarily the case. The most common cause of this effect is excessive protrusion of the diamond particles or small amounts of diamond particles from the nickel bond matrix, resulting in excessive fragmentation. By dressing the blade, this problem can be eliminated.