Electroformed Diamond Dicing Blade – Hub Type
Hub type electroforming nickel bonded dicing blade
Applications: dicing silicon wafers, copper wafer and compound semiconductor wafers such as GaAs and SiC.
Product Details
Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed .Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade.
Applications of electroformed diamond dicing blade
Scribing dicing silicon wafers, copper wafer and compound semiconductor wafers such as GaAs and SiC.
How to selection of the correct types of dicing blades to cut materials
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material
Drawing&Specification
| Exposure(μm) | 380 | 510 | 640 | 760 | 890 | 1020 | 1150 | 1270 | Grit Size |
| Kerf width(μm) | 380-510 | 510-640 | 640-760 | 760-890 | 890-1020 | 1020-1150 | 1150-1270 | 1270-1400 | #5000 #4800 #4500 #4000 #3500 #3000 #2500 #2000 #1800 #1700 #1500 |
| 16-20 | 20*380 | 20*510 | |||||||
| 21-25 | 25*380 | 25*510 | 25*640 | ||||||
| 26-30 | 30*380 | 30*510 | 30*640 | 30*760 | 30*890 | 20*1020 | |||
| 31-35 | 35*380 | 35*510 | 35*640 | 35*760 | 35*890 | 35*1020 | |||
| 36-40 | 40*380 | 40*510 | 40*640 | 40*760 | 40*890 | 40*1020 | 40*1150 | ||
| 41-50 | 50*380 | 50*510 | 50*640 | 50*760 | 50*890 | 50*1020 | 50*1150 | ||
| 51-60 | 60*510 | 60*640 | 60*760 | 60*890 | 60*1020 | 60*1150 | 60*1270 | ||
| 61-70 | 70*640 | 70*760 | 70*890 | 70*1020 | 70*1150 | 70*1270 | |||
| 71-80 | 80*890 | 80*1020 | 80*1150 | 80*1270 | |||||
| 81-90 | 90*1020 | 90*1150 | 90*1270 | ||||||
| Special size can be designed according to customers’ requirement | |||||||||
Case of Electroformed hub type diamond dicing blade for cutting wafer
| Workpiece parameters | |
| Wafer Material | LiNbO3 |
| Wafer size | 100mm |
| Wafer thickness | 1mm |
| Chip size | 1.3mm*1.5mm |
| Cutting lane width | 0.08mm |
| Quality requirements: Front chipping size: 0.005mm, Back chipping size : 0.010mm
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Current process parameters:
| Film type | UV film |
| Processed shape | round |
| Speed of mainshaft | Z1=15000rpm |
| Feed speed | 0.5mm/s |
| Blade height | Z1=0.100mm |
| Cooling water flow | 1.5L/min |
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