Polishing slurry
Silicon Carbide Lapping Slurry, diamond slurry
Coare/fine lapping
Grit:0.2-4μm
Silicon Carbide Lapping Slurry for Coarse
Application of Silicon Carbide Lapping Slurry
Silicon Carbide Lapping Slurry is mainly used for the prrocess of coarse grinding and thinning of silicon carbide wafers.
Advantages of Silicon Carbide Lapping Slurry
(1) Matched with cast iron plate to achieve high material removal rate meanwhile ensure the quality of silicon carbide wafer .
(2)Good anti-rust performance.
(3)Possesses stable suspension of diamond abrasives, and there is no obvious settlement phenomenon when placed for a long time.
(4)Strict quality control to ensure the consistency and stability of product quality.
Diamond slurry for lapping and polishing
Application of diamond slurry
Diamond slurry is mainly used for lapping and polishing of silicon carbide wafers.
Advantages of Diamond Lapping Slurry
(1)Matched with a special silicon carbide Lapping pad to achieve high removal rate and improve efficiency
(2)High surface quality of the silicon carbide wafer after lapping processing (roughness, scratch, sub-surface damage layer and other parameters)
(3)Water-soluble carrier formula with good cleaning performance
(4)Stable suspension
(5) Better lubrication performance.
Silicon Carbide Lapping Slurry dimensions
Particle Size | Abrasive Type | Density/Properties |
D50=2-4μm | Mono diamond | Stable suspension, water-based carrier |
Diamond slurry dimensions
Size specification | Abrasive Type | Characteristic |
D50=2-4μm | Poly/polycrystalline-like diamond | Stable suspension, water-based carrier |
D50=0-1μm | Poly/polycrystalline-like diamond | Stable suspension, water-based carrier |
D50=0.2μm | Polycrystalline-like diamond | Stable suspension, water-based carrier |
Related Products
Please Feel free to give your inquiry in the form below. We will reply you in 24 hours.