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diamond slurry
diamond slurry

Polishing slurry

Silicon Carbide Lapping Slurry, diamond slurry

Coare/fine lapping

Grit:0.2-4μm


Product Details

Silicon Carbide Lapping Slurry for Coarse 

Application  of Silicon Carbide Lapping Slurry

Silicon Carbide Lapping Slurry is mainly used for the prrocess of coarse grinding and thinning of silicon carbide wafers.

Advantages of Silicon Carbide Lapping Slurry

(1) Matched with cast iron plate to achieve high material removal rate meanwhile ensure the quality of silicon carbide wafer .

(2)Good anti-rust performance.

(3)Possesses stable suspension of diamond abrasives, and there is no obvious settlement phenomenon when placed for a long time.

(4)Strict quality control to ensure the consistency and stability of product quality.

Diamond slurry for lapping and polishing 

Application of diamond slurry

Diamond slurry is mainly used for lapping and polishing of silicon carbide wafers.

diamond slurry diamond slurry

Advantages of Diamond Lapping Slurry

(1)Matched with a special silicon carbide Lapping pad to achieve high removal rate and improve efficiency

(2)High surface quality of the silicon carbide wafer after lapping processing (roughness, scratch, sub-surface damage layer and other parameters)

(3)Water-soluble carrier formula with good cleaning performance

(4)Stable suspension

(5) Better lubrication performance.

Drawing&Specification

Silicon Carbide Lapping Slurry dimensions

Particle Size Abrasive Type Density/Properties
D50=2-4μm Mono diamond Stable suspension, water-based carrier

Diamond slurry dimensions

Size specification Abrasive Type Characteristic
D50=2-4μm Poly/polycrystalline-like diamond Stable suspension, water-based carrier
D50=0-1μm Poly/polycrystalline-like diamond Stable suspension, water-based carrier
D50=0.2μm Polycrystalline-like diamond Stable suspension, water-based carrier
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