Resin Diamond Dicing Blade for Silicon Wafer

1A8 Ultra-thin diamond dicing blade (over 0.75mm)

Improve chipping, blade life on hard and brittle materials

Applications: glass, quartz, LiTa03 LiNb03, QFN, splitter, sapphire, ceramic, etc

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Product Details

silicon wafer dicing blades

Resin bonded blades have excellent cutting ability that help reduce chippingm fractures, can efficiency improve cut quality and efficiency on ductile and gummy materials such as QFNs and coppers and on hard and brittle materials such as glass and ceramic.

Resin Diamond Dicing Blade for Silicon Wafer

Applications of diamond dicing blade
Resin Bond Diamond Dicing Blades are suitable for cutting scribing glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN （copper epoxy molding ), splitter, sapphire.

Resin Diamond Dicing Blade for Silicon Wafer wafer diamond dicing blade

How to selection of the correct types of dicing blades to cut materials
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material

Drawing&Specification

Grit Type	OD (mm)	ID(mm)	T(mm)	Grit Size
1A8 SD / CBN	50.8	25.4	0.07 – 0.3	#200 – #3000
	57.1	38.1
	50.8-76.2	40
	101.6 ,114.3	69.8
	101.6, 114.3, 127	76.2
	108.1, 127	88.82
	108.1, 127	88.9
Special size can be designed depending on customers’ requirement

Workpiece	PCB Material 1.2mm thick resin containing copper layer
Dicing Requirements	Cutting without burrs
	Incision perpendicularity < 0.005mm
	Cutting dimensional error < 0.02mm
	Snake cutting is not allowed
Dicing / Scribing Machine	Disco DAD3350 scribing machine
Diamond Dicing Blade	Metal Diamond Dicing Blade
Diamond Dicing Blade	58D x 0.15T x 40H (Grit 400# )
Cutting Parameters	1. Cutting direction: Straight cutting 2. Spindle speed: 30000rpm 3. Feed speed: 50mm/S 4. Cooling water: pure water

Material	Used to cut a sandwich composite material from 0.2 mm PZT piezoelectric ceramics bonded to 0.127mm stainless steel gasket core
Size of resin diamond dicing blade	D76.2xH12.7xT0.381mm 60μm
Requirement of customer	Cut clean, no burrs, no cracks
Test feedback	There are burrs, our surface does not look smooth, diamond sparkles.
Measures	Replaced with a fine grit resin diamond dicing blade to test again